Metal Coating: | Gold |
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Mode of Production: | SMT |
Layers: | Multilayer |
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PCB Manufacturing Capabilities | |
Layer count | 1-50 layers |
Material | FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz |
Board thickness | 0.2-10.0mm |
Min.line width/space | 3/3 mil(75/75um) |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Peelable solder mask | yes |
surface treating | HASL(ROHS), ENIG,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger |
Gold thickness | 2-40u" (0.05-0.76um) |
Special process | Buried Hole, Blind Hole, Partial high density, Back drilling, and Impedance control, etc. |
Quality standard | IPC Class 2 and IPC Class 3 |
PCBA Manufacturing Capabilities | |
Technology | SMD, THT,Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball |
SMT line | 11 SMT lines |
SMT capability | 20,000,000 points per day |
DIP capability | 500,000 points per day |
Experiences | QFP, BGA, μBGA, CBGA, VFBGA |
Testing | Flying Probe Test,X-ray Inspection, AOI Test, ICT(In Circuit Test),FCT(Functional Circuit Test) |
Process | Lead-free |
Programming | Yes |
Conformal coating | Yes |
Other capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection. |