| Customization: | Available |
|---|---|
| Metal Coating: | Enig / HASL / OSP / Silver etc. |
| Mode of Production: | SMT / DIP / PCB Manufacturing |
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| Layer count | 1-50 layers |
| Material | FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco |
| Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz |
| Board thickness | 0.2-10.0mm |
| Min.line width/space | 3/3 mil(75/75um) |
| Min. drill size | 8 mil(0.2mm) |
| Min. HDI laser drill size | 3 mil(0.067mm) |
| Tolerance of hole size | 2 mil(0.05mm) |
| PTH copper thickness | 1 mil(25 um) |
| Solder mask color | Green,blue,yellow,white,black,red |
| Peelable solder mask | yes |
| surface treating | HASL(ROHS), ENIG,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger |
| Gold thickness | 2-40u" (0.05-0.76um) |
| Special process | Buried Hole, Blind Hole, Partial high density, Back drilling, and Impedance control, etc. |
| Quality standard | IPC Class 2 and IPC Class 3 |


| Technology | SMD, THT, Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball |
| SMT line | 11 SMT lines |
| SMT capability | 20,000,000 points per day |
| DIP capability | 500,000 points per day |
| Experiences | QFP, BGA, μBGA, CBGA, VFBGA |
| Testing | Flying Probe Test, X-ray Inspection, AOI Test, ICT(In Circuit Test), FCT(Functional Circuit Test) |
| Process | Lead-free |
| Programming | Yes |
| Conformal coating | Yes |
| Other capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection |


Why choose us?| Turnkey PCB Assembly Process |
| FAQ |